This month on the Qualcomm’s Snapdragon Technology Summit. The firm unveiledÂ its latest flagship chipset 845. But that’s the Flagship device. If you are thinking that what’s coming to the mid-range,Â the specs for those chips have leaked today, ahead of what seems likely to be a CES announcement.
The three new chipset’s from Qualcomm are 460,640 and 670, whichÂ obviously range from lower mid-tier to upper mid-tier.
The above image shows that the Snapdragon 670 is the top featured among these three chipsets. It includes four Kryo 360 Gold cores and four Kryo 385 Silver cores, paired with a new Adreno 620 GPU. It also includesÂ Snapdragon X16 cellular modem, which offers gigabit LTE speeds if your carrier supports it.
Snapdragon 640 includes two Kryo 360 Gold cores, and six Kryo 360 Silver cores, along with an Adreno 610 GPU.Â Both the Snapdragon 640 and 670 can support a single-lens 26MP camera or dual 13MP cameras.
The third is Snapdragon 460, It includes eight cores those are Kryo 360 Silver, with the four more powerful cores clocked at 1.8GHz. And the four efficient cores clocked at 1.4GHz. It’s the only one of the chipsets that will still be built on a 14nm architecture, while the rest have been moved to 10nm.
All these specs are almost final, so Qualcomm might announce it at CES that is on January 9.
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